Design. Fabricate. Scale.
A leading-edge chip passes through more than a dozen stages in as many countries before it reaches a server, a car or a robot. SemiconductorX maps each stage: the materials, the wafer fabs and the 80-to-120-pass loop inside them, the tools, the packaging, and the companies that hold each step. For every stage it asks one question: how much of it is made in the United States today.
Hubs
Materials, process, equipment and packaging follow the wafer from quartz to a finished module. Fabs, chips and sectors show where it is made and where it goes. Spotlights and the supply-chain hub read the whole chain for one company, one system or one country.
How a wafer becomes a chip: the front-end loop of clean, deposit, pattern, etch and measure that repeats 80 to 120 times, then wafer test, assembly and module integration.
Quartz, polysilicon and wafers, the gases, chemicals and resists the fab consumes, and the critical elements China controls.
The tools that run each step: ASML lithography, Applied Materials, Lam and Tokyo Electron deposition and etch, KLA inspection, and the testers and bonders of the back end.
Where AI chips are now assembled into one machine: CoWoS, SoIC, EMIB and Foveros, the substrates under them and the OSATs that run them.
Logic, memory, power, analog, RF, optoelectronic and sensor chips: what each does, who makes it and on which process.
The 158 fabs and packaging plants in the SemiconductorX dataset, read by type: leading-edge and mature logic, DRAM, NAND, SiC, GaN, analog, image sensors and more. The utilities that keep them running, power, ultrapure water, cleanrooms and gas delivery, sit alongside.
Where the chips go: AI and data centers, vehicles, robots and humanoids, phones and PCs, telecom, energy, space and defense.
One company or system read through its whole supply chain: NVIDIA, TSMC, ASML, Samsung, Huawei, Wolfspeed and the Tesla Terafab.
The bottlenecks that set the pace, how much of each stage is coming back to the US, the policy and risk behind it, and the workforce it needs.
Start here
The manufacturing flow, the stages that set the pace of the industry, and where the United States stands in each.
Four segments and the six-step loop that builds every layer of a chip.
ConstraintEUV, HBM, CoWoS, substrates, gallium and the other stages held by one or two suppliers.
ReshoringWhich fabs, packaging plants and material lines are being built in the United States, and when they produce.
StructureIDM, foundry, fabless and OSAT: who designs, who fabricates and who packages.
Chip supplier rings
An AI accelerator is a logic die, stacks of HBM, an interposer and a substrate, joined in one package and tested. Each flagship chip gets one supplier ring: who makes each of those parts, in which plant, and whether that plant is in the United States. The rack-scale rings on DatacentersX stop at the chip; these rings open it.
| Chip | Designer | Logic die | Memory | Packaging | US-made share |
|---|---|---|---|---|---|
| NVIDIA Blackwell Ultra (B300) | NVIDIA | Placeholder | Placeholder | Placeholder | Placeholder |
| NVIDIA Rubin | NVIDIA | Placeholder | Placeholder | Placeholder | Placeholder |
| AMD Instinct MI455X | AMD | Placeholder | Placeholder | Placeholder | Placeholder |
| Google TPU Ironwood | Google and Broadcom | Placeholder | Placeholder | Placeholder | Placeholder |
| AWS Trainium3 | AWS (Annapurna Labs) | Placeholder | Placeholder | Placeholder | Placeholder |
| Huawei Ascend 910C | HiSilicon | Placeholder | Placeholder | Placeholder | Placeholder |
| Tesla AI5 | Tesla | Placeholder | Placeholder | Placeholder | Placeholder |
| Placeholder: rows from the chip supplier-ring dataset | |||||
Fab dataset
The dataset holds the fabs and packaging plants that lead or define their type, not every fab in the world, so the counts below show where SemiconductorX looks, not world capacity shares. Each fab-type page reads its rows, and each fab has its own record.
Fabs in the SemiconductorX dataset by country. Capacity, node, status and supply-chain risk for each row are on Fab Facilities.
Across the network
SemiconductorX stops at the packaged chip and module. The rack and data center above it, the Texas fabs around it, and the vehicles and robots that carry it each have a sister site.
Servers, racks, network fabrics, power and cooling, and the rack-scale supplier rings.
Texas fabsSamsung Taylor, TI Sherman, the Terafab and the supplier rings around them.
ElectrificationVehicles, robots, batteries and the power chips that drive them.
In orbitRad-hard chips, orbital compute and the space-industrial buildout.
The book
Daniel M. Sisson
The AI-Industrial Revolution From Austin to Alpha Centauri. The book sets out the Industrial Triad of fabs, data centers and gigafactories; SemiconductorX keeps the fab side of it current, stage by stage.